PDF Design Type Resistance (at 25 °C) (kOhm)
Glass-encapsulated sensors with insulation G1551 5 - 100
Leaded NTC thermistors, lead spacing 2.5 mm M891 1 - 470
Leaded NTC thermistors, lead spacing 2.5 mm S981 2.1 - 30
Probe assemblies K504 10
Leaded NTC thermistors, lead spacing 2.5 mm S871 2.1 - 30
Glass-encapsulated sensors with insulation G1561 2 - 100
Leadless NTCs M820 560.2 - 1014
Probe assemblies K276 4.829, 11.981
Miniature sensors with bendable wires S869 3 - 30
Probe assemblies with O-ring sealing K301-A001 9.959
Probe assemblies M2020 5
Probe assemblies K45 1 - 150
Leaded NTC thermistors, lead spacing 2.5 mm S881 2.1 - 30
Leaded NTC thermistors, lead spacing 5 mm K164 0.015 - 470
Probe assemblies M703 5 - 30
Leaded NTC thermistors, lead spacing 5 mm S875 2.1 - 30
Glass-encapsulated sensors with insulation G1541 10 - 100
Miniature sensors with bendable wires S867 2 - 50
Probe assemblies Z81 11.991
Miniature sensors with bendable wires S861 2 - 50
Glass-encapsulated sensors G1540 10 - 100
Probe assemblies F120 10.151
Probe assemblies K227 32.762
Leaded NTC thermistors, lead spacing 2.5 mm S964 2 - 5
Leaded NTC thermistors, lead spacing 5 mm S885 2.1 - 30
Glass-encapsulated sensors G1550 5 - 100
Leadless NTCs K1150 2394
Probe assemblies K500, K501 6.8, 10
Miniature sensors with bendable wires S863 3 - 30
Leadless NTCs K220 2056.9
Probe assemblies K560 49.12
Glass-encapsulated sensors G1560 2 - 100
Probe assemblies K301-A003 10
Leadless NTCs K350 990.2
Probe assemblies M500 10
Probe assemblies K514 48.538
Probe assemblies T120 10.11, 10.151
NTC chip thermistors, bondable S860 5 - 85
Leaded NTC thermistors, lead spacing 2.5 mm S891 2.2 - 100
Leaded NTC thermistors, lead spacing 2.5 mm S971 2 - 30
Probe assemblies M1703 100
Glass-encapsulated sensors for media contact G1565 10
Miniature sensors with bendable wires S864 2 - 5

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