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Aluminum electrolytic capacitors

Rugged versions with higher ripple current capability

TDK Corporation presents a new series of rugged EPCOS axial-lead aluminum electrolytic capacitors for automotive electronics. These components are distinguished by their very high ripple current capability and vibration resistance.

June 2013
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EMC components

Extremely miniaturized multilayer chip beads with excellent noise attenuation

TDK Corporation has developed a miniaturized multilayer chip bead series in case size 0603 (EIA 0201) that is nearly 80 percent smaller in volume and 65 percent in area than existing MMZ1005-E types with comparable performance.

May 2013
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Multilayer ceramic chip capacitors

Portfolio of automotive-grade C0G mid-voltage MLCCs expanded

TDK Corporation has expanded its leading portfolio of automotive-grade MLCCs with new mid-voltage types featuring C0G temperature characteristics and rated voltages from 100 V to 630 V. The new components in the CGA series offer capacitance values that are very high for C0G components.

May 2013
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Power factor correction

Two new controllers with expanded functionality

TDK Corporation presents two new types of the BR7000 series of EPCOS power factor controllers. The BR7000-T power factor controller offers 15 transistor outputs instead of 15 relay outputs. The second innovation is the EPCOS BR7000-I with an RS485 interface.

April 2013
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EMC components

IEC inlet filter portfolio expanded

TDK Corporation has expanded the proven EPCOS B84771* IEC inlet filter series with two new series: The B84773* series features an integrated fuse, while the B84776* series has both a switch and a fuse.

March 2013
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Film capacitors

MKP types with reduced volume

TDK Corporation presents EPCOS MKP film capacitors of the B3267*P* series with a significantly reduced volume. For example the type with a capacitance of 1 µF and a rated voltage of 450 V DC has dimensions of only 8.0 x 17.5 x 13.0 mm³.

February 2013
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Modules

World’s first IC embedded power management module for smartphones and tablets

TDK Corporation presents a new series of highly integrated, multi-channel power management modules for smartphones and tablets. Based on TDK’s SESUB technology (semiconductor embedded in substrate), the new module is the world’s first IC embedded power management module for smartphones and tablets.

February 2013
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Multilayer ceramic chip capacitors

World’s smallest automotive-grade MLCCs in the mega cap class

TDK Corporation has expanded its CKG series of MEGACAP Type MLCCs to include miniature 1608 to 3216 (EIA 0603 to 1206) packages. Until now these MLCCs were available only in 3225 to 5750 packages (EIA 1210 to 2220).

January 2013
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Multilayer ceramic chip capacitors

High reliability MLCCs for automotive applications in a 0603 (EIA 0201) package

TDK Corporation presents the new CGA1 series of 0603 (EIA 0201) MLCCs for use in automotive electronics applications. With dimensions of only 0.6 x 0.3 x 0.3 mm³, the new components offer rated voltages from 6.3 V to 50 V.

January 2013
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EMC components

1005 (EIA 0402) noise absorbers reduce voltage ringing in switch-mode power supplies

TDK Corporation has developed the YNA15 series of noise absorbers in case size 1005 (IEC) to suppress voltage ringing that can be caused by switch-mode power supplies (SMPS).

December 2012
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Multilayer ceramic chip capacitors

0603 (EIA 0201) MLCCs enable high-density mounting

TDK Corporation has developed the CJA series of TDK SRCT capacitors in case size 0603 (EIA 0201). Compared to existing multilayer ceramic capacitors (MLCCs) of the same case size, the mounting footprint has been reduced by 50 percent.

December 2012
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Multilayer varistors for mobile devices

Miniature shield against overvoltages

EPCOS multilayer varistors offer a wide range of advantages compared with semiconductor-based solutions. They include lower clamping voltages, superior thermal behavior and lower costs.

November 2012
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SAW components

Highly integrated front-end module for smartphones

TDK Corporation presents the new highly integrated EPCOS D5058 front-end module for smartphones. In addition to the conventional GSM bands at 850, 900, 1800 and 1900 MHz, it also covers WCDMA bands 1, 2, 4 and 5, as well as LTE bands 2, 4, 5 and 17.

November 2012
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Aluminum electrolytic capacitors

Extended rated voltages for industrial applications

TDK Corporation has extended the range of EPCOS aluminum electrolytic capacitors by types with higher rated voltages.

November 2012
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Aluminum electrolytic capacitors

Snap-in series with very high ripple current capability and longer useful life

TDK Corporation offers two new 105 °C snap-in series of EPCOS aluminum electrolytic capacitors with a very high ripple current capability and a longer useful life.

November 2012
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Acoustic components

MEMS microphone with high signal-to-noise ratio

TDK Corporation presents the new EPCOS C914 MEMS microphone. It offers a particularly high signal-to-noise ratio (SNR) of 65 dB(A) in the frequency range from 20 Hz to 20 kHz.

November 2012
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Acoustic components

Top-port MEMS microphones with flat frequency response

TDK Corporation presents the two new EPCOS C920 and C923 MEMS microphones. With footprints of only 2.75 x 1.85 mm² each and an insertion height of 0.9 mm, they are among the smallest top-port microphones worldwide.

November 2012
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SESUB modules for smartphones

Very small and extremely flat

SESUB (semiconductor embedding substrate) technology successfully leverages TDK and EPCOS know-how and enables a technological breakthrough: miniature TDK SESUB modules with an abundance of functions.

November 2012
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Multilayer ceramic chip capacitors

C0402 (EIA 01005) MLCC with twice the capacitance

TDK Corporation presents a new MLCC in size 0402 (IEC) with the highest rated capacitance of 0.22 µF. The TDK C0402 is designed for decoupling applications in compact mobile devices such as smartphones.

October 2012
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Film capacitors

LCap combines capacitor and choke

TDK Corporation presents the LCap, a new film capacitor from EPCOS for motor applications. LCap combines an AC capacitor with a choke coil in a single case, cutting costs and halving assembly times.

October 2012