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Film capacitors

LCap combines capacitor and choke

TDK Corporation presents the LCap, a new film capacitor from EPCOS for motor applications. LCap combines an AC capacitor with a choke coil in a single case, cutting costs and halving assembly times.

October 2012
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Multilayer varistors

E series for automotive electronics

TDK Corporation has extended its product range of EPCOS multilayer varistors with the new E series, which is designed to assure protection from current surge pulses in automotive electronics. Thanks to their innovative glass passivation, the SMD protection components that are qualified to AEC-Q200 with an extended stress test are even more rugged and reliable than before.

October 2012
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Inductors

Four new series of thin-film metal power inductors

TDK Corporation has developed four new series of miniature, low-profile thin-film metal power inductors featuring up to twice the rated current and half the DC resistance of comparable ferrite inductors.

September 2012
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New dimensions in integration and miniaturization

Smartphones need more than ever – but smaller than ever

TDK Corporation is successfully leveraging the strengths of both TDK’s and EPCOS' technologies to achieve new dimensions in miniaturization and integration and offer compact products with extremely low insertion heights.

September 2012
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Surge arresters

Arrester stack for telecommunications equipment

TDK Corporation presents a new EPCOS gas-filled surge arrester. This component consists of a stack of five individual arresters and was developed specifically to protect the power supplies of telecommunications equipment.

September 2012
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Inductors

High-frequency multilayer inductor series with world’s highest inductance value

TDK Corporation expanded its MLG0402Q series of high-frequency multilayer inductors with new types that achieve inductance values of up to 33 nH, the world’s highest for a tiny 0402 inductor (EIA).

August 2012
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EMC components

Thin-film common-mode filter with the world’s highest cutoff frequency

TDK Corporation has developed a new thin-film common-mode filter with the world’s highest cutoff frequency of 10 GHz, enabling it to efficiently reduce high frequency noise emissions, especially in the 5 GHz band.

August 2012
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Multilayer ceramic chip capacitors

MLCCs with a rated AC withstanding voltage

TDK Corporation has developed a multilayer ceramic chip capacitor that – in addition to its rated DC voltage of 630 V – can withstand a rated AC voltage of 500 VRMS for 60 s and 600 VRMS for 3 s.

July 2012
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Film capacitors

MKP high density series expanded

TDK Corporation has expanded the high density series of EPCOS MKP film capacitors with two new voltage classes. The B32774* to B32778* series of DC link film capacitors are now available for rated voltages of 575 V DC and 900 V DC.

July 2012
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EMC components

World’s smallest common-mode filter for high-speed interfaces

TDK Corporation has developed the world’s smallest common-mode filter, which measures in at only 0.45 x 0.30 x 0.23 mm and is 75 percent smaller than current 0806 filters (IEC). Besides its miniature dimensions, the new TCM0403S-350-2P thin-film common-mode filter offers excellent performance.

July 2012
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RF components

High-performance multilayer band pass filter in 1005

TDK Corporation has developed a multilayer band pass filter in size 1005 that is significantly smaller than the 1608 types. With its miniature dimensions of just 1.0 x 0.5 x 0.37 mm, the insertion height of the new band pass filter has been reduced by more than a third and its volume by 75 percent.

June 2012
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Inductors

SMT version with highest reliability

TDK Corporation presents a new series of EPCOS SMT inductors with the highest reliability. The components of the new R series offer 30 percent higher saturation current capability than standard series types. The saturation current is between 1.05 and 38.0 A at inductance values from 0.82 to 1000 µH. The DC resistance is between 5.0 mΩ and 1.35 Ω.

May 2012
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Multilayer ceramic chip capacitors

High-capacitance X8R MLCCs for high temperatures up to 150 °C

TDK Corporation has expanded its portfolio of TDK X8R multilayer ceramic chip capacitors with new types that offer up to twice the capacitance of existing components with the same dimensions.

April 2012
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NTC and PTC thermistors

Reliable limiting of current surges

Ceramic EPCOS NTC and PTC thermistors protect the inputs of power supplies efficiently and cost-effectively from excessive inrush and surge currents.

April 2012
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EMC components

Common-mode filter with improved performance in a smaller package

TDK Corporation presents the new ACP3225 series of common-mode filters that offers improved performance in a smaller package when compared to existing products. Thus, the new wirewound common-mode filter features a current capability of 1.2 A and a common-mode impedance of 1,000 Ω.

April 2012
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Inductors

Ultra high-Q multilayer inductors

TDK Corporation presents the new MHQ1005P series of multilayer ceramic inductors with a Q factor that, depending on the type, is as good or much better than comparable, but more expensive, wirewound inductors.

April 2012
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Inductors

Compact multilayer power inductors in case size 1608

TDK-EPC, a group company of the TDK Corporation, has extended its portfolio of compact multilayer power inductors to include the TDK MLP1608-V series in size 1608. The miniaturized components are suited for use in the power supply circuitries of mobile devices such as smartphones, conventional mobile phones, digital cameras and similar products.

February 2012
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Inductors

Compact storage chokes for high currents

TDK-EPC, a group company of TDK Corporation, has extended the range of its standard ERU series of power inductors with the EPCOS ERU 20 series. These new components are characterized by a particularly high current capability.

January 2012
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Film capacitors

Wide range with low insertion height

TDK-EPC, a group company of the TDK Corporation, has developed a wide range of EPCOS MKP and MKT film capacitors with low insertion heights. The new capacitors of the B32*6T series with a lead spacing of 37.5 mm feature insertion heights of only 15 or 19 mm.

December 2011
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RF components in DSSP technology

A new dimension in miniaturization

With innovative die-sized SAW packaging technology DSSP® from EPCOS, TDK drives miniaturization of RF filters and duplexers. These components are up to 85 percent smaller than the first generation CSSP® products.

October 2011