Chip Dicing Specialist

Tasks

  • Release of new/modified products and processes
  • To work on rationalization projects to improve operational efficiency through cost reduction and process yield enhancement
  • To work on projects which include the concept design, cost calculation, and successful implementation
  • Produce sample as per specifications for on-time customer qualification
  • In house process improvement and controlling such as,
  • Perform study and evaluation upon receiving BFR and Production Defective Report
  • Process and material study upon receiving the non-conformance from production
  • Preform process capability analysis and capacity study
  • To improve processes in achieving of TQM target
  • Monitoring of production performance, machine performance & scrap development as well

Required education

Degree / Diploma in Engineering discipline

Requirements

  • Experience (minimum 5 years)
  • Experience in manufacturing sector
  • Experience of working in ISO 9000/QS9000/VDA 6.1 quality system environment
  • Experience in chip / wafer dicing & drift study is preferable
  • Experience in using DISCO dicing machine 300 series, 600 series & 3000 series is preferred
  • Experience is using other dicing / sawing machine also acceptable
  • Experience in set up of process before & after dicing process

Knowledge

  • Basic knowledge of electrical / electronic components
  • Knowledge in mechanical engineering
  • Knowledge in usage of different film foil or wax for fixing the wafer
  • Knowledge of working with computers using Microsoft office, Autocad, etc
  • Knowledge in process monitoring and improvement tools such as SPC, Six sigma, etc
  • Able to communicated well in English, (Spoken and written)
  • Good interpersonal and analytical skills

Location

Batam, Indonesia

Address

PT EPCOS Indonesia
Human Ressources
Ms. Sinaga
Jalan EPCOS Jaya
Kawasan Industri Panbil Blok B1-10
Pulau Batam 29433

hr.BT@epcos.com