May 23, 2017

Noise suppression sheets: Ultra-thin magnetic sheets with high permeability

TDK Corporation has expanded its Flexield family of noise suppression sheets with an ultra-thin copper-clad laminated sheet with high magnetic permeability. The new IFM10M magnetic sheets are 60 percent thinner than existing sheets with a magnetic layer of the same thickness.

April 27, 2017

Technical Cooperation Award: Goldwind honors EPCOS in China

TDK Corporation announces that EPCOS Sales China has received the 2016 Technical Cooperation Award from the Chinese wind turbine manufacturer Goldwind Science and Technology for the company's dedicated and excellent technical and after-sales support. 

April 11, 2017

Inductors: Choke for automotive power over coax

TDK Corporation presents the new ADL3225V choke for automotive power over coax (PoC) applications. The wire wound inductor, which has a DC resistance of 0.9 Ω, features high impedance over a broad frequency spectrum of 1 MHz up to 1 GHz. 

April 3, 2017

TDK Europe GmbH: Ludger Trockel new President of TDK Europe

TDK Corporation announces that effective April 1, 2017, Ludger Trockel (53) has been named President of TDK Europe GmbH, the company's European sales organization. TDK Europe’s management team also includes Andreas Keller (47) and Josef Vissing (53). Keller, Senior Executive Vice President, will serve as the TDK Europe Managing Director alongside Trockel. Vissing, Executive Vice President, will serve as Deputy Head of Sales.

March 23, 2017

Ceramic capacitors: CeraLink™ types with higher rated voltage

TDK Corporation has extended the CeraLink™ series with two low-profile (LP) types designed for a rated voltage of 900 V DC. The SMT capacitors have a capacitance of 0.25 µF and feature different terminations: the B58031I9254M062 type with L-style termination has dimensions of 10.84 mm x 7.85 mm x 4 mm, while the B58031U9254M062 with J-style termination measures only 7.14 mm x 7.85 mm x 4 mm.

March 21, 2017

EMC components and inductors: First chip beads and inductors with robust soft termination

TDK Corporation presents the world’s first multilayer chip beads and inductors with the innovative soft-termination technology that is already proven in TDK MLCCs. The external electrodes of the new KMZ1608 and KPZ1608 series of chip beads and the KLZ1608 and KLZ2012 series of inductors feature a conductive resin layer. 

March 7, 2017

EMC components: Miniaturized LC filters for suppression of EMI

TDK Corporation presents the MEM1005PP251T – a new LC filter for EMI suppression. With dimensions of just 1.0 x 0.5 x 0.35 mm the filters are ideally suited for use in smart phones and base stations. Volume production began in March 2017.

February 28, 2017

Capacitors: Data book for aluminum electrolytic capacitors

TDK Corporation presents the fully revised data book for EPCOS aluminum electrolytic capacitors with screw terminal, snap-in, axial and single-ended designs. In addition to proven products the book also contains many innovations, including the B43742* and B43762* screw terminal series, which feature an extremely compact design.

February 14, 2017

Ultra-thin PiezoHapt™ actuator with low driving voltage

TDK has expanded its portfolio of haptic components with the new ultra-thin PiezoHapt™ actuator featuring a very short response time of just 4 ms. PiezoHapt has a unimorph design consisting of a multilayer piezo element bonded to one side of a vibration plate. With a thickness of a mere 0.35 mm the new haptic actuator is much thinner than conventional eccentric rotary motors and linear resonant actuators, and one of the world's thinnest haptic devices.

February 3, 2017

Qualcomm and TDK Announce Launch of Joint Venture

Qualcomm Incorporated and TDK Corporation today announced the completion of the joint venture under the name RF360 Holdings Singapore PTE. Ltd. The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more.

January 24, 2017

Multilayer ceramic chip capacitors: Expanded lineup of automotive-grade MLCCs for high-temperature applications

TDK Corporation has expanded its CGA series of automotive-grade MLCCs for high-temperature applications: New MLCCs with X8L temperature characteristics have been introduced and the capacitance range of its existing X8R types has been extended. 

January 10, 2017

Film capacitors: Robust industrial grade X2 capacitors with a rated voltage of
350 V AC

TDK Corporation presents a new series of robust EPCOS MKP X2 capacitors for EMI suppression. Compared with conventional X2 capacitors designed for rated voltages of 305 V AC, these new components offer a higher rated voltage of 350 V AC. 

December 21, 2016

Public tender offer by TDK subsidiary EPCOS to acquire Tronics successful

TDK Corporation and Tronics Microsystems SA jointly announced today that the all-cash public tender offer launched by TDK’s wholly-owned subsidiary EPCOS AG was successfully closed on December 14, 2016. EPCOS, a leading manufacturer of electronic components, modules and systems based in Munich, Germany, acquired 72.38% of the outstanding shares at a price of EUR 13.20 per share, thus exceeding the defined 65.41% success threshold for the offer. The acquisition of these shares represents a value of approximately EUR 33.432 million. The settlement of the tender offer will occur on December 27, 2016. 

December 8, 2016

Inductors: SMT high-current chokes with a compact design

TDK Corporation has extended its portfolio of EPCOS ERU SMT power inductors with the ERU16 choke series that comprises ten different types. The inductance values of the new B82559*A016 series extend from 1.0 µH to 30 µH and their saturation currents range from 9.2 A DC to 37 A DC. 

November 29, 2016

Multilayer ceramic chip capacitors: Automotive-grade soft-termination and MEGACAP Type MLCCs with C0G characteristics

TDK Corporation has expanded its lineup of automotive-grade soft-termination and MEGACAP Type MLCCs with new C0G types. Until now, these robust MLCC designs, which offer effective protection against board flexure and solder cracks, have been available with X5R, X7R and X8R dielectric materials. 

November 9, 2016

CeraPad™: Ultra-thin substrate with integrated ESD protection

TDK Corporation presents CeraPad™, a new ultra-thin ceramic substrate that features integrated ESD protection within its multilayer structure and eliminates the need for discrete ESD components.

November 9, 2016

Aluminum electrolytic capacitors: First ever vibration strength of 60 g

TDK Corporation presents the first aluminum electrolytic capacitors that are specified for 60 g in accordance with IEC 60068-2-6. The new generation offers the highest vibration strength and the best electrical performance in a single component.

November 9, 2016

Piezo actuators with haptic feedback: New dimensions in performance

TDK Corporation presents the innovative piezo actuator with haptic feedback and integrated sensor functionality. The new actuator features unrivalled performance in terms of acceleration, force and response time.

November 9, 2016

Public tender offer for the shares of Tronics Microsystems - Filing by EPCOS AG of "Other Informations" document with AMF

Please note that this information is only available in French.

November 8, 2016

Film capacitors: MKP types for up to 125 °C

TDK Corporation presents a new series of EPCOS MKP (metallized polypropylene) film capacitors for DC link and DC filter applications. The outstanding feature of these components is their high permissible operating temperature of 125 °C.