Solutions for power electronics
- March 5 to 7, 2018
- Monday: 17:00 to 20:00
Tuesday: 12:00 to 17:00
Wednesday: 10:00 to 14:00
- Henry B. Gonzalez Convention Center, San Antonio, Texas, USA
- Stand 901
Welcome to the Applied Power Electronics Conference 2018! The APEC is one of the leading events for power electronics in the USA. On display are EPCOS, TDK and TDK-Lambda products and solutions for automation, drives and traction. In particular, capacitors, inductors, protection devices, and wireless charging components and systems will be on show.
Broad spectrum of CeraLink™ capacitors
The portfolio of CeraLink™ capacitors based on PLZT ceramic (lead lanthanum zirconate titanate) includes a wide range of designs. Low profile (LP) types for SMD soldering are available with a voltage of 500 V and a capacitance of 1 µF, or with 700 V and 0.5 µF. The capacitors are characterized by their extreme volume efficiency and compactness. The dimensions of the variants with L-style terminal, for example, are 10.84 mm x 7.85 mm x 4 mm. Thanks to the compactness and the permissible maximum temperature of 150 °C, these capacitors can, for example, be embedded as snubber capacitors directly into IGBT modules.
Types with J-style terminals have an even more compact design, with dimensions of just 7.14 mm x 7.85 mm x 4 mm. One great advantage of the CeraLink LP types is their extremely low ESL of just 2.5 nH.
The CeraLink solder-pin (SP) type is available for higher capacitance values of 20 µF and 10 µF for the rated voltages of 500 V and 700 V, respectively. This type has a very low ESL of just 3.5 nH.
Thanks to their low parasitic effects, CeraLink capacitors are ideally suitable for converter topologies on the basis of fast-switching semiconductors such as GaN or SiC. Voltage overshoots and ringing when switching are significantly lower than with conventional capacitor technologies.
Distributed air gaps enable a 70 percent reduction in additional copper losses
New TDK ferrite cores enable for the first time additional copper losses to be reduced by up to 70 percent. The core design using distributed air gaps permits higher operating frequencies and smaller inductive components to be used in power supply systems. By reducing electromagnetic emissions, the additional copper losses at high frequencies are also reduced. Thanks to the identical distributed gaps in the center posts, the magnetic field emission to the environment is effectively prevented.
Ferrite cores are available with distributed air gaps in E, EQ, ER, ETD, PM and PQ core designs, and with all EPCOS power materials. Solutions with three identical air gaps offer the best price/performance ratio for applications, in which 2 or 3 times the switching frequency is used in comparison with the original frequency. Apart from standard solutions, a customer-specific number of air gaps can also be implemented.
The main applications for the new cores are in storage chokes and transformers in switch-mode power supplies and inverters.
Perfect fitting DC link capacitor for IGBT modules
The EPCOS DC link capacitor has been specifically designed for the HybridPACK™ 1-DC6 IGBT module from Infineon Technologies. The outstanding features of this component are the six busbar terminals with dimensions that are matched precisely to fit the IGBT module. This multiple contacting produces an excellent current capability while at the same time offering very low parasitics. For example, the ESR has a maximum value of 0.6 mΩ and the ESL value is just 25 nH. Thanks to this low ESL, voltage peaks on switching off the IGBTs are almost completely eliminated.
The capacitor with the ordering code B25655P4607J021 is designed for a rated voltage of 450 V DC and offers a capacitance of 600 µF. Its current capability is about 150 A at a maximum ambient temperature of 105 °C and a cooled temperature on the underside of 75 °C. The component is designed using power capacitor chip (PCC) technology in which the capacitor element is constructed as a stacked winding, with which a volume fill factor of nearly 1 is achieved. The dimensions of the housing are correspondingly compact, at just 140 mm x 72 mm x 50 mm.
Furthermore, a flat winding version is offered in the same housing (B25655P4477J121). This type has a capacitance of 470 µF and is likewise designed for 450 V DC. At a maximum ambient temperature of 105 °C and a cooled temperature on the underside of 75 °C, its current capability is about 150 A. The ESR value of this design is 0.8 mΩ and the ESL value is 25 nH.
Apart from the standard version, the capacitor is also available with an additional connection for the EPCOS high-voltage DC EMC filter. All in all, the combination of the IGBT module with the new link circuit capacitor enables the design of extremely compact inverters for xEV applications or for use as industrial inverters.