November 2016

Multilayer ceramic chip capacitors

Automotive-grade soft-termination and MEGACAP Type MLCCs with C0G characteristics

  • Capacitance drift of only 0.3 percent over a temperature range from
    -55 ºC to +125 ºC
  • High capacitance stability at a high DC bias
  • Qualified to AEC-Q200

TDK Corporation has expanded its lineup of automotive-grade soft-termination and MEGACAP Type MLCCs with new C0G types. Until now, these robust MLCC designs, which offer effective protection against board flexure and solder cracks, have been available with X5R, X7R and X8R dielectric materials. The new types combine the low relative permittivity of the C0G dielectric with rated capacitance values up to 300 nF and enable MLCCs to be used in an even greater range of applications where reliability is required. Their rated voltages range from 50 V to 3000 V.

The new MLCCs feature high capacitance stability at a high DC bias. Moreover, the capacitance drift is only 0.3 percent over a broad temperature range from -55 ºC to +125 ºC, making the new Class 1 MLCCs especially well-suited for the high-precision resonant circuits for fast and efficient automotive wireless charging and in LLC resonant circuits of onboard chargers for plug-in hybrid and electric vehicles. The new types are qualified to AEC-Q200. In addition to the expanded range of automotive applications, the new C0G MLCCs are also suitable for use in circuits requiring high reliability or as replacements for other types of capacitors. Mass production and sales of the new components will begin in December 2016. 

Glossary

  • C0G: A dielectric material with a temperature characteristic in which capacitance changes within only 0.3% over a temperatures range from -55 ºC to 125 ºC.
  • Class 1 ceramic capacitors: Offer high stability and low losses for resonant circuit applications.
  • Soft termination: The terminal electrode of standard products consists of three layers: copper (Cu), nickel (Ni), and tin (Sn). The terminal electrode of soft-termination products consists of four layers, with a resin layer inserted between the copper and the nickel to protect against board flexure cracks, solder cracks from thermal shocks.
  • MEGACAP Type: An MLCC design with metal lead frames attached to both ends of an MLCC to protect against board flexure cracks, solder cracks from thermal shocks. MEGACAP Type MLCCs are available in two basic designs: the single type and the stacked type.

Main applications

  • Wireless chargers for electric vehicles
  • LLC resonant circuits of onboard chargers for plug-in hybrid and electric vehicles
  • Circuits that require high reliability (time constant circuits, filter circuits, resonant circuits, oscillation circuits, snubber circuits, etc.) 

Main features and benefits

  • Capacitance drift of only 0.3 percent over a temperature range from -55 ºC to +125 ºC
  • High capacitance stability at a high DC bias
  • Effective protection against board flexure and solder cracks
  • Qualified to AEC-Q200.

Key data

Soft-termination MLCCs with resin terminal electrode layer

Series

Case size [IEC]Rated voltage[V]Max. capacitance[nF]
CGA21005 (EIA 0402)50, 1001
CGA31608 (EIA0603)50 to 25010
CGA42012 (EIA 0805)50 to 45033
CGA53216 (EIA 1206)50 to 630100
CGA63225 (EIA 1210)100 to 100068
CGA84532 (EIA 1812)630, 300033
CGA95750 (EIA 2220)100 to 630150


MEGACAP Type MLCCs with metal lead frames

SeriesCase size [IEC]Rated voltage [V]Max. capacitance [nF]
CKG32K3225 (EIA 1210), single type100 to 100068
CKG45K4532 (EIA 1812), single type250 to 63068
CKG45N4532 (EIA 1812), stacked type250 to 630140
CKG57K5750 (EIA 2220), single type250 to 630150
CKG57N5750 (EIA 2020), stacked type250 to 630300


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