TDK Electronics · TDK Europe

Multilayer Piezo Actuator Stacks

High active stacks with copper inner electrodes 

Intro Pic

Numerous high-end solutions use piezo actuators with High Active Stack (HAS) technology from TDK, for example in nano-positioning, valve controls for liquids and gasses in process engineering, and in semiconductor manufacturing. Based on copper inner electrodes in multilayer piezo actuators – this patented technology by TDK has been used in fuel injection systems in automotive for over 20 years.

High active stacks offer superior performance, robustness to moisture, and a longer lifetime, even in harsh conditions, compared to conventional silver-palladium (AgPd) stacks.

What’s special in TDK’s actuator stacks?

Pic Structure

Minimized inactive areas for higher performance and longer lifetime

Powerful

The inactive areas in an actuator are a cause of mechanical stress during operation. The larger the inactive areas are, the more mechanical stress the actuator will have, creating larger cracks in the ceramic. The width of the inactive area per layer in TDK stacks is 100 µm (compared to 400 µm in conventional ones) which significantly reduces mechanical stress, enables longer lifetimes and higher operating voltages (of up to 180 V), generating a higher stroke or elongation (ca. +20 %), hence the name High Active Stacks.

Copper inner electrodes for superior robustness against humidity and cost-effectiveness

Robust Humid

Conventional stack actuators use silver-palladium alloy for the inner electrodes. Silver is a very ductile metal under humid conditions and electric fields. As a result of this phenomenon, short circuits or failures occur between the actuator's inner electrode layers. TDK HAS components use copper in their inner electrodes to prevent migration between their layers. Additionally, copper prices are more stable than palladium, enabling cost-effective solutions with superior performance. Win-Win!

A lead-free high melting metal bond for operation at high temperatures

Temperature

The metal bonds that connect the external electrodes are also exposed to high mechanical stress during operation, especially at high temperatures. TDK developed a new lead-free high-melting metal bond that does not become brittle even at high temperatures and thus does not lose contact. This innovative bond is more reliable than a lead-based solder for electrode contacting as its properties are more porous and flexible. TDK HAS devices passed a 2000-hour test at 200 °C with no signs of embrittlement; conventional solder contacts failed after 1500 hours at temperatures of only 180 °C.

Portfolio overview

COM10S5
COM30S5
COM45S5
COM30S7
COM27S3

COM10S5

COM30S5

COM45S5

COM30S7

COM27S3

Dimensions
[mm] (l x w x h)

5.2 x 5.2 x 10
Passivated

5.2 x 5.2 x 30 
Passivated

5.2 x 5.2 x 45 
Passivated

7.0 x 7.0 x 30 
Passivated

3.4 x 3.4 x 27 
Leaded

Preload
[N]

730

730

730

1320

320

Stroke
[µm]

16

55

83

55

47

Capacitance
[µF]

1.0

3.4

5.3

6.2

1.3

Stiffness
[N/µm]

79

25

16

45

12

Blocking force
[N]

1400

1400

1400

2600

600

Applications

Countless high-end solutions in nano-positioning technology, micro-dispensing valves for semiconductor manufacturing and adhesives in production processes, and bonding wire machines are based on piezo actuators from TDK.

Microdispensing
Nanopositioning
Flow controllers

Benchmark

TDK’s HAS technology impresses with its outstanding blocking force and stroke compared to conventional silver-palladium stacks.

Force Pic

Scatterplot of force [N] vs stroke [µm] of piezo stack 7 x 7 x 30 mm³ @ 160 V

Temperature Pic

Elevated temperature test
Weibull – 95 % CI

Humidity Pic

Dynamic humidity test
Weibull – 95 % CI

Get data sheets and search

PDF Type Dimensions (l x w x h) (mm) Stroke (µm) at 160 V Stiffness (N/µm) (typ.) at 160 V (kstack) Blocking force (N) Ordering code
COM10S5  5.2 x 5.2 x 10 16 ±10% 79 1400 Z63000Z2910Z001Z78
COM27S3 3.4 x 3.4 x 27 47 ±10% 12 600 Z63000Z2910Z001Z77
COM30S5  5.2 x 5.2 x 30 55 ±10% 25 1400 B58004M4030A020
new 		COM30S7  7.0 x 7.0 x 30 55 ±10% 45 2600 B58004M4037A020
COM45S5  5.2 x 5.2 x 45 83 ±10% 16 1400 B58004M4040A020

In order to download up to 20 files together as zip, please mark them with the check box. To start the download, please click the Download button at the end of the list.

Number of Products 5 Help
Parameters
Search Criteria
Voltage range (V)
Dimensions (l x w x h) (mm)
Application
Type
Status

Product resources

Step Files

COM10S5

 STEP - 396.6 KB Download

COM30S5

 STEP - 1.0 MB Download

COM45S5

 STEP - 1.5 MB Download

COM30S7

 STEP - 1.1 MB Download

COM27S3

 STEP - 1.3 MB Download

Get in touch with the experts

Do you want to know more about HAS? Please briefly describe your application. Our piezo experts will be glad to help you. 

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