PDF Design Type Resistance (at 25 °C) (kOhm)
NTC chip thermistors, bondable S860 10 - 85
Glass-encapsulated sensors with insulation G1551 2 - 230
Glass-encapsulated sensors G1540 5 - 100
Glass-encapsulated sensors G1550 2 - 230
Glass-encapsulated sensors G1560 2 - 230
Glass-encapsulated sensors with insulation G1541 5 - 100
Glass-encapsulated sensors with insulation G1561 2 - 230
Miniature sensors with bendable wires S861 2 - 50
Leaded NTC thermistors, lead spacing 2.5 mm S871 2.1 - 30
Miniature sensors with bendable wires S864 2 - 5
Leaded NTC thermistors, lead spacing 2.5 mm S881 2.1 - 30
Leadless NTCs K1150 2.394
Leadless NTCs K220 2.0569
Leaded NTC thermistors, lead spacing 5 mm S875 2.1 - 30
Leaded NTC thermistors, lead spacing 2.5 mm S971 2 - 30
Leaded NTC thermistors, lead spacing 2.5 mm M891 1 - 470
Leaded NTC thermistors, lead spacing 2.5 mm S981 2.1 - 30
Leaded NTC thermistors, lead spacing 5 mm K164 0.015 - 470
Leadless NTCs K350 9.902
Glass-encapsulated sensors for media contact G1565 10
Miniature sensors with bendable wires S863 3 - 30
Miniature sensors with bendable wires S867 2 - 50
Leaded NTC thermistors, lead spacing 5 mm S885 2.1 - 30
Leaded NTC thermistors, lead spacing 2.5 mm S891 2.2 - 100
Leadless NTCs M820 0.5602 - 1.014
Miniature sensors with bendable wires S869 3 - 30

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